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Job Opportunities

Opportunities (January, 2015)

1. Finisar


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Finisar

World's Largest Supplier of Optical Communication Components and Subsystems

Position: Sr. Product Engineer

KEY JOB DUTIES & RESPONSIBILITIES:

  •  The Product Engineer for Optical Transceiver Modules will be assigned products in one or more transceiver form factors used in data and telecommunication applications (Parallel Optics, QSFP, CFP, XFP, and SFP+).
  • The Product Engineer will interface closely with design engineers during product development to learn the design and help to provide alpha/beta samples for customers out of the pilot line.  Concurrently, the Product Engineer will be working extensively with software and hardware engineers to develop the test process and test systems that will be used to test the optical modules once released into production.
  • The Product Engineer will define test parameters based on product and design specifications.
  • Once product design has been frozen, the Product Engineer will transfer the manufacturing and testing of the product to overseas manufacturing facility.
  • The Product Engineer will also interface with sales and product marketing teams to ensure accurate product customization.
  • The Product Engineer will have the ownership of the assigned products including, but not limited to, the Assembly and Test Procedures, Process Flow, Yield, Cost Model, Debug Tree, Test Scripts, etc.
  • The Product Engineer must take initiatives, be highly organized, and be motivated to solve issues in timely manner.

 SKILLS & QUALIFICATIONS:

  • BS (5 years’ experience) or MS (2+ years’ experience) in EE/Engr. Physics or equivalent field

  • Hands on working knowledge of optoelectronic components and modules. Understand the properties of various types of lasers and photodiodes. Ability to understand and optimize specifications from device level to OSA and module level.
  • Familiarity with the development of test software and testing automation. The ideal candidate should have the experience in automation development of the optoelectronic device setup and the testing verification of optical/electrical parameters.
  • Ability to read and interpret complex engineering data sheets and specifications. Ability to do a gap analysis between customer and internal specifications. Ability to analyze the impact of changes to production specifications whether they are electrical, optical, or mechanical.
  •  Ability to analyze yield data and identify root cause of failures whether they are a result of design, process, materials, or test repeatability. Familiarity with optical and electrical test methods.
  • Experience in developing and transferring products into high volume offshore manufacturing. Interact often with offshore manufacturing facilities both as part of transfer activities and helping to drive ongoing cost/yield improvements.
  •  Experience with optical transceivers, parallel optics, VCSEL array, RF, and analog/digital circuit is a plus.

 

Position: Process Engineer

KEY JOB DUTIES & RESPONSIBILITIES:

  • Develop assembly processes for Finisar’s innovative high speed transceiver modules.
  • Work with module design groups to ensure manufacturability of module assemblies in Finisar’s factories.
  • Provide “hands-on” development of new or improvement of existing assembly processes.
  • Coordinate design and fabrication of process tooling fixtures.
  • Support new product introduction (NPI) in initial prototype builds and introduce/transfer module assemblies into mass production.
  • Generate/maintain documentation for new processes and provide training for technicians and operators.
  • Analyze process capability to drive improvements to ensure high quality and yields.
  •  Travel to interact with overseas production facilities (Malaysia and China).
  • Work with sub-contractors to ensure their processes meet our design requirements.
  • Work closely with entire module design group, and support the team by providing/coordinating appropriate DFM reviews, committing to development schedules, and meeting project milestones.
SKILLS/QUALIFICATIONS: 
  • BS in Engineering.
  • Experience in package design and assembly process development for microelectronic, optoelectronic and fiber-optics components and assemblies.
  • Working experience in PCB and flex circuit fabrication, reflow and hot bar process and fiber routing and termination processes.
  • Hands-on experience and knowledge with various assembly equipment and processes such as screw fastening equipment, epoxy dispensing equipment, flex to PCB and flex to ceramic package attachment processes.
  • Excellent analytical & problem-solving skills.
  • Proven track record of successfully transferring products into high volume manufacturing including frequent interaction with manufacturing teams both as part of transfer activities and ongoing cost/yield improvement projects.
  • Knowledge of SolidWorks mechanical design software and Agile is preferred.
  • Proficient in data analysis & design of experiments (DOE).
  • Expertise in the development/operation of production tooling and fixtures, and in the use of standard lab tools and metrology equipment.
  • Excellent communication, planning, organizational, and interpersonal skills.

 

Position: Sr. Principal Engineer

#5741

KEY JOB DUTIES & RESPONSIBILITIES:

  • Implement digital and analog equalization techniques
  • Conceive, analyze, and simulate advanced modulation schemes and DSP algorithms for novel fiber optic communication systems
  • Support transceiver integration into customer communication systems
  • Contribute to optical Transceiver DSP Architectures including definition of DSP ICs and DSP firmware
  • Analyze, Model, Simulate, Define, Develop, Measure and Verify DSP based optical systems
  • Contribute to the definition of new DSP approaches to optical interfaces
  • Support major Finisar programs in 100G client and line side optics
  • Contribute to the definition and execution of research projects into advanced optical interfaces
  • Support Signal Processing IC design

SKILLS/QUALIFICATIONS: 

  • Strong signal processing and modeling skills required
  • Strong laboratory measurement and data analysis skills
  • Industry experience with optics communication system modeling, design, debug, and verification
  • Delivered complex DSP based products, in communications or other fields
  • Strong experience in writing and debugging real time signal processing firmware
  • Strong experience with micro-controllers and development systems
  • Highly self-motivated with a strong multi-disciplinary background
  • Ph.D. degree or equivalent experience

 

Position: Sr. PCB Design Engineer with Flex, IPC, and PADs experience

#5711

 KEY JOB DUTIES & RESPONSIBILITIES:

 Sr. PCB Layout Designer will be responsible for the layout and routing of advanced technology printed wiring circuit board designs in both rigid and flex with signal speeds in excess of 10 GB/s. This will include the generation of all fabrication and assembly packages required for product development and production.

  •   Create new flex and rigid multilayer printed wiring board designs.
  • Edit and revise existing flex and rigid multilayer printed wiring board designs.
  • Supporting comprehensive design reviews and documentation.
  • Able to work well individually or with teams of layout designers supporting internal customer needs.
  • Follow formal processes and procedures for meeting company design requirements.
  • Post processing of all output generation of release documentation for production.

 SKILLS & QUALIFICATIONS:

  • 7+ Years’ experience and proficient in PADs Logic, PADs Layout, AutoCAD, and CAM350 required.
  • Flex design experience required.
  • Expertise in Co-planar waveguides.
  • Expertise in high speed differential and single ended impedance controlled signal routing.
  • Expertise in HDI design, transmission lines, microstrip and stripline routing.
  • Experience with chip-on-board (COB), chip-on-flex (COF), and Flip Chip Technology.
  • Experience with BGA technology 0.5mm pitch and smaller.
  • Understanding of Stubs, reflections, crosstalk, ground bounce (or switching noise).
  • Experience working with interconnecting signals paths at 10 GB/s and higher.
  • Experience designing complex analog and digital circuits on high-density printed circuit boards both rigid and flex with mixed surface-mount and thru-hole technology.
  • Good understanding of fabrication, assembly, and documentation processes.
  • C.I.D.+ certification preferred.
  • Understanding of IPC design standards and specifications required.
  • Good oral and written communications skills.
  • Experience using Microsoft Office Suite.
  • An A.A. degree in Electronic Design or equivalent formal training.

 

Position: Application Software Developer

#5699

KEY JOB DUTIES & RESPONSIBILITIES:

Design & develop firmware regression test system, R&D test scripts, Test software platform, test data base and its web scripts.

  • Work closely with module, firmware and product engineers for daily support on firmware regression test, R&D evaluation tool design, R&D qualification test automation design and Transceiver software platform design.
  • Maintain and enhance all software and test design documents.
  • Collaborate and synchronize the development work with application and test developers at different sites on all software tools under development.
  • Fulfill test requests and generate test reports timely.
  • Provide introduction and training on all software applications developed.
  • Traveling to Asia and regional countries might be required on project basis.

SKILLS/QUALIFICATIONS: 

  • BS or higher on computer science/engineering and/or electronics/electrical engineering or equivalent.
  • Familiar with the IEEE488, I2C, SPI, MDIO interface protocols.
  • Proficient with .Net C#, Python Script programming.
  • Good understanding of software development life cycle and quality control.
  • Proficient in using test and measurement equipment such as oscilloscopes, logic analyzer, BERT etc.
  • Experiences in the following areas would be added advantages:
  • Fiber optic transceiver technologies and MSA standard
  • Strong knowledge in firmware quality assurance, testing and validation methodology
  • Strong board level hardware design knowledge or experience

o Experience software development experience in Java, Silverlight, MySQL under  Microsoft Windows OS

o   Hardware debugging experience

o   Verilog or VHDL design

  • Self-motivated and able to work well independently and within a team.
  • Must be able to travel to other Finisar sites within a short notice.

 

Finisar is an Equal Opportunity Employer.

Send your application to Henry Meyer Daghighian (henry.daghighian@finisar.com)

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